(57) ABSTRACT A semiconductor device has a first semiconductor die with a sloped side
surface. The first semiconductor die is mounted to a temporary carrier. An RDL extends from …

A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS
microphone secured to the base within the interior, and an integrated circuit embedded in …

(57) ABSTRACT A compact camera module is coupled at an image sensor end to a flexible
printed circuit (FPC) and an FPC extension segment and is configured such that, upon …

4,273,415 A 6, 1981 Sonnet RE42, 118 E 2/2011 Hudyma et al. 4,353,634. A 10/1982
Himmelsbach 7,884,303 B2 2/2011 Partlo et al. 4,384,769 A 5, 1983 Brei et al. 7,885,008 B2 …

4,353,634. A 10/1982 Himmelsbach 7,768,574 B2 8/2010 Humpston 4,384,769 A 5, 1983
Brei et al. 7,791,825 B2 9/2010 Hackemer 4,645.314 A 2f1987 Schroder 7,807,508 B2 …

Backside recesses inabase member host components, such as sensors or circuits, to allow
closer proximity and efficient use of the surface space and internal volume of the base …

(57) ABSTRACT A method for bonding a first copper element onto a second copper element
including forming a crystalline copper layer enriched in oxygen on each of surfaces of each …

An optical assembly for a point action camera or other compact digital camera having a wide
field of view, includes multiple lens elements, including at least one lens element that has an …

7, 218, 445 B2 5/2007 Shafer et al. 7, 224, 056 B2 5/2007 Burtzlaff et al. 7, 237, 915 B2
7/2007 Hudyma 7, 237, 935 B2 7/2007 Ito et al. 7, 244, 056 B2 7/2007 Koike et al. 7, 345 …

4,645,314 A 2f1987 Schroder 7,807,508 B2 10/2010 Oganesian et al. 4,695.136 A 9, 1987
Schitthof 7,839,532 B2 11/2010 Brawn et al. 4756.60 A 7, 1988 Schroder 7,858,445 B2 …