Metallic copper, which has low electrical resistivity and high thermal conductivity, is widely
used as an interconnector or substrate within microelectronic packages. If a small amount of …

The present invention relates to attachment of integrated circuits to other integrated circuits
and/or intermediate sub strates. Integrated circuit dies (“chips”) can be attached to a lead …

With the advancement of Moore's Law reaching its limits, advanced packaging technologies
represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and …

“Design Notes: understanding Ball Grid Array Packages' Electronics by Design, www.
electronicsby design. com. au, issue 1997.10, pp. 1-4. Sperling, Ed; Electronic News, Sep …

Printed board assemblies, ie components soldered on printed circuit boards (PCBs), are
exposed to thermal cycles responsible for fatigue cracking of solder joints as a result of …

Intermetallic compound (IMC) growth was investigated under isothermal aging condition at
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …

Low cycle fatigue (LCF) tests for 95.5 Sn–3.8 Ag–0.7 Cu and 99.3 Sn–0.7 Cu Pb-free
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …

The effect of electromigration on ductile-to-brittle transition in flip chip solder joints has been
studied using one-dimensional bamboo-type samples of eutectic 95.5 Sn–3.8 Ag–0.7 Cu …

An improved Anand constitutive model is proposed to describe the inelastic deformation of
lead-free solder Sn-3.5 Ag used in solder joints of microelectronic packaging. The new …

Thermal fatigue is one of the main causes of device failure in micro-electro-mechanical
systems (MEMS). Gold wire bonding plays the role of electrical connection and signal …