Graphene-based aerogels (GA) have a high potential in the biomedical engineering field
due to high mechanical strength, biocompatibility, high porosity, and adsorption capacity …

Purpose The purpose of this paper is to publish on the review of the lead free solder for
electronic packaging. This involved the basic principles of the solder, the lead solder and its …

The paper presents the description of an experimental complex that has been designed for
investigations of high temperature capillarity phenomena by various testing methods …

Abstract Carbon/Aluminum (C/Al) composites are receiving great attentions because they
can present both good mechanical and electrical performance while keeping lightweight …

Novel aluminum/sintered-carbon (Al/SC) composites for pantograph sliders were produced
by means of pressure infiltration method, in which five porosity sintered carbon preforms …

The wetting behavior of liquid magnesium drop on pure tungsten substrates was
investigated, for the first time, with the sessile drop method combined with non-contact …

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices.
However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid …

Thermal stability and wettability are important properties for under bump metalization (UBM)
in electronic devices. This study aims at preparing the Ni-Fe-P coatings with varying …

The sessile drop method was applied to the experimental investigation of the wetting and
spreading behaviors of liquid Mg drops on pure Ni substrates. For comparison, the …

The chip-to-chip bonding technique using Cu-pillars bump is widely applied in 3D chip
stacking technology. The excessive growth of intermetallic compounds (IMC) is expected to …