Survey on fatigue life prediction of BGA solder joints
B Qiu, J Xiong, H Wang, S Zhou, X Yang, Z Lin, M Liu… - Electronics, 2022 - mdpi.com
With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …
electronic devices present a trend of more diverse functions and thinner bodies. This makes …
A state-of-the-art review of fatigue life prediction models for solder joint
Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model
An intelligent system for reflow oven temperature settings based on hybrid physics-machine
learning model | Emerald Insight Books and journals Case studies Expert Briefings Open Access …
learning model | Emerald Insight Books and journals Case studies Expert Briefings Open Access …
Reflow recipe establishment based on CFD-Informed machine learning model
This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
model to set the temperature of a convection reflow oven and control conveyor speed. Due …
Smarter temperature setup for reflow oven to minimize temperature variation among components
The thermomechanical reliability of surface mount components (SMCs) is closely related to
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
the reflow soldering process. With the rise of board complexity, an optimal reflow profile must …
Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems
Package level bare die jet impingement cooling on the chip backside has been previously
demonstrated as a highly efficient jet cooling solution for high power devices, by eliminating …
demonstrated as a highly efficient jet cooling solution for high power devices, by eliminating …
Thermo-Mechanical Challenges of 2.5 D Packaging: A Review of Warpage and Interconnect Reliability
H Kim, JY Hwang, SE Kim, YC Joo… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Advanced packaging technology, also known as system scaling, bridges the gap between
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …
Determination of smarter reflow profile to achieve a uniform temperature throughout a board
Uneven temperature distribution poses a big challenge on reflow soldering of surface mount
components. Particularly, when components with different thermal mass are mounted on a …
components. Particularly, when components with different thermal mass are mounted on a …
Chiplet Heterogeneous Integration
JH Lau - Semiconductor Advanced Packaging, 2021 - Springer
Recently, heterogeneous integration of chiplets (chiplet heterogeneous integration or
heterogeneous chiplet integration) is getting lots of tractions [,,,,,,,,,,,,,,,,–]. Microprocessors …
heterogeneous chiplet integration) is getting lots of tractions [,,,,,,,,,,,,,,,,–]. Microprocessors …
Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints
R Zheng, W Li, M Cheng, H Zheng, Z Zhao… - Microelectronics …, 2024 - Elsevier
Abstract Printed Circuit Board Assemblies (PCBA) are crucial components of integrated
circuit products. To address the issue of solder joint failure in PCBA under thermal cycling …
circuit products. To address the issue of solder joint failure in PCBA under thermal cycling …