Attojoule optoelectronics for low-energy information processing and communications

DAB Miller - Journal of Lightwave Technology, 2017 - ieeexplore.ieee.org
Optics offers unique opportunities for reducing energy in information processing and
communications while simultaneously resolving the problem of interconnect bandwidth …

Micro‐transfer‐printed III‐V‐on‐silicon C‐band semiconductor optical amplifiers

B Haq, S Kumari, K Van Gasse, J Zhang… - Laser & Photonics …, 2020 - Wiley Online Library
The micro‐transfer‐printing of prefabricated C‐band semiconductor optical amplifiers
(SOAs) on a silicon waveguide circuit is reported. The SOAs are 1.35 mm in length and 40 …

Optical interconnects for extreme scale computing systems

S Rumley, M Bahadori, R Polster, SD Hammond… - Parallel Computing, 2017 - Elsevier
Large-scale high performance computing is permeating nearly every corner of modern
applications spanning from scientific research and business operations, to medical …

Flip-chip integration of InP to SiN photonic integrated circuits

M Theurer, M Moehrle, A Sigmund… - Journal of Lightwave …, 2020 - ieeexplore.ieee.org
We present our hybrid InP to SiN TriPleX integration interface with a novel alignment
technique and its application to complex photonic integrated circuits. The integration …

Germanium based photonic components toward a full silicon/germanium photonic platform

V Reboud, A Gassenq, JM Hartmann, J Widiez… - Progress in Crystal …, 2017 - Elsevier
Lately, germanium based materials attract a lot of interest as they can overcome some limits
inherent to standard Silicon Photonics devices and can be used notably in Mid-Infra-Red …

From chip to cloud: Optical interconnects in engineered systems

AV Krishnamoorthy, HD Thacker… - Journal of Lightwave …, 2017 - opg.optica.org
The high-performance server compute landscape is changing. The traditional model of
building general-purpose enterprise compute boxes that end-users can configure with …

InP-based foundry PICs for optical interconnects

FM Soares, M Baier, T Gaertner, N Grote, M Moehrle… - Applied Sciences, 2019 - mdpi.com
This paper describes a fabrication process for realizing Indium-Phosphide-based photonic-
integrated circuits (PICs) with a high level of integration to target a wide variety of optical …

Flip-chip integration of InP and SiN

M Theurer, M Moehrle, A Sigmund… - IEEE Photonics …, 2019 - ieeexplore.ieee.org
We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-
nitride-based photonic platforms. The design enables efficient high optical power coupling …

Packaging and assembly challenges for 50G silicon photonics interposers

B Snyder, N Mangal, G Lepage… - Optical Fiber …, 2018 - opg.optica.org
We address the challenges in realizing low-loss, broadband optical interfaces for high-
density fiber or polymer waveguides along with through-silicon via interconnects in a 50 …

High-speed and efficient silicon modulator based on forward-biased pin diodes

S Akiyama, T Usuki - Frontiers in Physics, 2014 - frontiersin.org
Silicon modulators, which use the free-carrier-plasma effect, were studied, both analytically
and experimentally. It was demonstrated that the loss-efficiency product, α· V π L, was a …