Printed circuit board (PCB) technology for electrochemical sensors and sensing platforms
H Shamkhalichenar, CJ Bueche, JW Choi - Biosensors, 2020 - mdpi.com
The development of various biosensors has revolutionized the healthcare industry by
providing rapid and reliable detection capability. Printed circuit board (PCB) technology has …
providing rapid and reliable detection capability. Printed circuit board (PCB) technology has …
BGA brittle fracture-alternative solder joint integrity test methods
K Newman - … Components and Technology, 2005. ECTC'05., 2005 - ieeexplore.ieee.org
A solder ball shear and pull testing study was conducted on 27 unique package
constructions, evaluated under a wide variety of test conditions. The study encompassed the …
constructions, evaluated under a wide variety of test conditions. The study encompassed the …
Kirkendall voids at Cu/solder interface and their effects on solder joint reliability
Z Mei, M Ahmad, M Hu… - … and Technology, 2005 …, 2005 - ieeexplore.ieee.org
Previous studies, especially papers by TC. Chiu, K. Zeng, R. Stierman and D. Edwards, K.
Ano (2004) and M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and KN Tu (2004) ECTC conference …
Ano (2004) and M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and KN Tu (2004) ECTC conference …
Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel
Soldering onto nickel (Ni) pads almost invariably results in the formation of submicroscopic
voids between intermetallic compound (IMC) Ni3Sn4 and the solder. However, these voids …
voids between intermetallic compound (IMC) Ni3Sn4 and the solder. However, these voids …
Diffusion barrier properties of the intermetallic compound layers formed in the Pt nanoparticles alloyed Sn-58Bi solder joints reacted with ENIG and ENEPIG surface …
H Choi, CL Kim, Y Sohn - Materials, 2022 - mdpi.com
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold …
Bending properties of anisotropic conductive films assembled chip-in-flex packages for wearable electronics applications
In this paper, a chip-in-flex (CIF) assembly that has an excellent bending performance,
including a minimum bending radius without a chip fracture and the capacity to withstand …
including a minimum bending radius without a chip fracture and the capacity to withstand …
Influence of Pd (P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd (P)/Ni (P)/Cu multilayer
CY Lee, SP Yang, CH Yang, MK Lu, TT Kuo… - Surface and Coatings …, 2020 - Elsevier
Autocatalytic plating deposition of a Pd (P) film over a Ni (P) metallization pad, such as
Au/Pd (P)/Ni (P)(electroless nickel/electroless palladium/immersion gold, ENEPIG), has …
Au/Pd (P)/Ni (P)(electroless nickel/electroless palladium/immersion gold, ENEPIG), has …
Assessing the risk of “Kirkendall voiding” in Cu3Sn
P Borgesen, L Yin, P Kondos - Microelectronics Reliability, 2011 - Elsevier
A common location of sporadic, usually unpredictable, premature failures of both SnPb and
Pb-free solder joints is within the intermetallic bond to one of the contact pads. Cu pads tend …
Pb-free solder joints is within the intermetallic bond to one of the contact pads. Cu pads tend …
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3. 5Ag solders
WM Chen, P McCloskey, SC O'Mathuna - Microelectronics Reliability, 2006 - Elsevier
The reliability of the eutectic Sn37Pb (63% Sn37% Pb) and Sn3. 5Ag (96.5% Sn3. 5% Ag)
solder bumps with an under bump metallization (UBM) consisting of an electroless Ni (P) …
solder bumps with an under bump metallization (UBM) consisting of an electroless Ni (P) …
Correlation between chemical reaction and brittle fracture found in electroless Ni (P)/immersion gold–solder interconnection
YC Sohn, J Yu - Journal of materials research, 2005 - Springer
Occurrence of brittle interfacial fracture at an electroless Ni (P)/immersion gold–solder joint
has long been a serious problem not yet fully understood. In our previous report on the …
has long been a serious problem not yet fully understood. In our previous report on the …