Atomic layer deposition (ALD) has been traditionally regarded as an extremely powerful but
slow thin-film deposition technique. The (perceived) limitation in terms of deposition rate has …

In this paper, a new route for a selective deposition of thin oxide by atomic layer deposition
is discussed. The proposed process is using super cycles made of an additional plasma …

A selective deposition process for bottom-up approach was developed in a modified plasma
enhanced atomic layer deposition (PEALD) sequence. As a case study, a very standard …

Due to the reduction of the thickness of the layers used in the advanced technology nodes,
there is a growing importance of the surface phenomena in the definition of the general …

In this article, we propose a novel cell transistor structure to facilitate the mass production of
4F 2 dynamic random access memory (DRAM). 3-D TCAD simulation results show that the …

超导量子计算是目前最有可能实现实际应用的量子计算方案之一, 多层堆叠是实现超导量子比特
大规模扩展的最佳方案. 介绍了超导量子芯片中硅穿孔(TSV) 填充工艺的特点并汇总概括了当前 …

As one of the key enabler of 3D integration, Through Silicon Via (TSV) was widely
investigated but not largely adopted in the advanced packaging industry. At the present time …

Superconducting quantum is one of the leading candidates in the race to build a quantum
computer and multi-layer stacking may be the best solution for the superconducting qubits …

abstract Atomic layer deposition (ALD) has been traditionally regarded as an extremely
powerful but slow thinfilm deposition technique. The (perceived) limitation in terms of …