Fundamental research and continued miniaturization of materials, components and systems
have raised the need for the development of thermal‐investigation methods enabling ultra …

Thermal characterization becomes challenging as the material size is reduced to
micro/nanoscales. Based on scanning probe microscopy (SPM), scanning thermal …

Thermal images of active semiconductor devices are acquired and processed in real time
using visible light thermoreflectance imaging with 34 mK sensitivity. By using a 16× 16 …

Measuring techniques of the die surface temperature in integrated circuits are reported as
very appropriate for failure analysis, for thermal characterization, and for testing modern …

Nonstoichiometric nickel–manganese spinel oxides, NixMn3− x▭ 3δ/4O4+ δ (1≥ x≥ 0),
have been synthesized by calcination in air of mixed oxalates at 623 K. These materials are …

Since local thermal probing has become a major tool for studying transport phenomena at
micro-and nanoscale levels, the fundamental aspect of the interaction between the tip of the …

Modern, high-density integrated circuits (IC) typically use a flip chip bonding technique to
increase performance on a greater number of interconnects. In doing so, the active devices …

Fundamental research and continued miniaturisation of systems (materials or components)
have instigated and still require today the development of specific investigative methods for …

We have developed a scanning near field microscopy system based on tapered silver halide
fibers which had tips of diameters smaller than a wavelength. The system was calibrated for …

In this paper, a set-up based on the internal IR-laser deflection technique is described. This
technique allows measurement of the temperature gradient and free-carrier concentration …