High throughput flip chip processing and reliability analysis using no-flow underfills
R Thorpe, DF Baldwin… - 1999 Proceedings. 49th …, 1999 - ieeexplore.ieee.org
As a concept to achieve high throughput low cost flip chip on board (FCOB) assembly, a
process development activity is underway, implementing next generation flip chip …
process development activity is underway, implementing next generation flip chip …
Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials
R Thorpe, DF Baldwin, B Smith… - IEEE Transactions on …, 2001 - ieeexplore.ieee.org
As a concept to achieve low-cost, high-throughput flip chip on board (FCOB) assembly, a
new process has been developed implementing next generation flip chip processing based …
new process has been developed implementing next generation flip chip processing based …
Analysis of process yield in low cost flip chip on board assembly processes
R Thorpe, LP McGovern… - ASME …, 1998 - asmedigitalcollection.asme.org
As a concept to achieve high throughput low cost flip chip on board (FCOB) assembly, a
process development activity has been undertaken implementing next generation flip chip …
process development activity has been undertaken implementing next generation flip chip …
No flow underfill: additional reliability and failure mode analysis
MA Previti, P Ongley - Microelectronics international, 2002 - emerald.com
No‐Flow or fluxing underfills will play a key role in the future of flip chip processing. Properly
formulated No‐Flow Underfills decrease manufacturing time and cost of producing flip chip …
formulated No‐Flow Underfills decrease manufacturing time and cost of producing flip chip …
New chip scale package with CTE matching to the board
RD Schueller, J Geissinger - Proceedings of the 1997 1st …, 1997 - ieeexplore.ieee.org
This paper outlines a few of the more promising chip scale package configurations and
discusses where they stand with respect to some of the ideal requirements for a CSP, these …
discusses where they stand with respect to some of the ideal requirements for a CSP, these …
Manufacturing analysis of underfill processing for low-cost flip chip assembly
DF BALDWIN, NW PASCARELLA - Journal of Electronics …, 1998 - World Scientific
Advanced electronics assembly based on direct attachment of semiconductor devices to
printed circuit boards is a rapidly growing technology. Direct chip attach (DCA) or flip chip on …
printed circuit boards is a rapidly growing technology. Direct chip attach (DCA) or flip chip on …
SLIM: third generation of packaging beyond MCM, CSP, flipchip and micro-via board technologies
RR Tummala - Proceedings of 2nd Electronics Packaging …, 1998 - ieeexplore.ieee.org
The Packaging Research Center at Georgia Tech proposes to address packaging needs by
using a technical vision for the next generation of packaging similar to what ICs did for …
using a technical vision for the next generation of packaging similar to what ICs did for …
Reliability analysis of flip chip on board assemblies using no-flow underfill materials
R Thorpe, DF Baldwin - … Engineering Congress and …, 1999 - asmedigitalcollection.asme.org
As a concept to achieve high throughput low cost flip chip on board (FCOB) assembly, a
process development activity and reliability assessment is underway, implementing next …
process development activity and reliability assessment is underway, implementing next …
[引用][C] A New Enhanced Flex Based Chip Scale Package with Improved Board Level Reliability
RD Schueller