In the paper the problem of modelling thermal properties of semiconductor devices with the
use of compact models is presented. This class of models is defined and their development …

In this paper, the problem of how to describe the thermal properties of the insulated-gate
bipolar transistor (IGBT) module with the use of the compact thermal model is considered …

This article proposes effective methods of measurements and computations of internal
temperature of the dies of the Insulted Gate Bipolar Transistor (IGBT) and the diode mounted …

In this paper, the nonlinear compact thermal model of power semiconductor devices based
on the Cauer network is proposed. The analytical description of the model and the method of …

In this paper, a new method of measuring transient thermal impedance of power LEDs and
radial power is proposed. The idea of the method is described, and the measurement setup …

In this paper, the analytical description of the nonlinear thermal model of the semiconductor
device considering the influence of the selected factors on its thermal resistance is …

In this paper, the results of investigations concerning the influence of a soldering process on
the thermal properties of large LED modules are presented. The convection reflow soldering …

Purpose This paper aims to present the results of the influence of a manner of soldering light
emitting diodes (LEDs) to the metal core printed circuit board on thermal parameters of the …

This paper proposes the form of a compact thermal model of pulse transformer. This model
takes into account self-heating and mutual thermal coupling between the windings and the …

The aim of this paper is to compare the thermal properties of monocrystalline GaN devices
assembled to direct bonding copper (DBC) substrate by silver sintering and solid-liquid …