We develop a linear-complexity direct matrix solution for the surface integral equation (IE)-
based impedance extraction of arbitrarily shaped 3-D nonideal conductors embedded in a …

The accurate electromagnetic modeling of both low-and high-frequency physics is crucial in
the signal and power integrity analysis of electrical interconnects. The boundary element …

A new first-principles-based volume integral equation (VIE) formulation is developed for the
broadband full-wave extraction of general 3-D circuits, containing arbitrarily shaped lossy …

A surface integral equation (SIE) formulation under the magneto-quasi-static assumption is
proposed to efficiently and accurately model arbitrarily shaped interconnects in packages …

Surface integral equation (SIE) methods are of great interest for the numerical solution of
Maxwell's equations in the presence of homogeneous objects. However, existing SIE …

Real conductors of interconnect structures are lossy and their skin depth becomes large at
low frequencies. The traditional one-region formation with the approximation of perfectly …

In this work, the loop-star and loop-tree basis function approach is applied to multiple,
complicated and mixed surface and wire geometries, including a number of separate …

This thesis describes a few efficient parasitic extraction algorithms based on integral
equation methods. It has two parts. Part one describes the algorithms used in FastImp, a …

The rapidly increasing complexity of electronic hardware, such as integrated circuits and
advanced electromagnetic surfaces, tends quickly to outgrow the capabilities of existing …

A linear-complexity direct matrix solution is developed for the surface-integral based
impedance extraction of arbitrarily-shaped 3-D non-ideal conductors embedded in dielectric …