Whisker publications from 1947 through 2004 are summarized and referenced in this
document. The bibliography listings are chronological (by publication year) while the …

Previous theories of the tin whisker growth proposing various dislocation mechanisms have
been largely disproved. This paper presents a new and different theory for the mechanism of …

Over 50 years of whisker research (cadmium, zinc, and tin) has not resulted in consensus
about whisker formation fundamentals for metal films. New analytical tools have recently …

Additive manufacturing (AM) of metallic structures by laser based layered manufacturing
processes involve thermal damages. In this work, the feasibility of mask-less electrochemical …

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free
Soldering in Electronics considers the necessary background and requirements for proper …

Corrosion characteristics of Sn–3.0 Ag–0.5 Cu (SAC) solder doped with In and Zn in NaCl
solutions were conducted by sweeping the voltage at a constant rate with a potentiostat …

Soldering is technically defined as the joining of two base materials through the use of a
third “filler” metal with a melting temperature well below those of the substrates and typically …

Replacement of Pb/Sn terminations on electronic devices with pure Sn has proven to be
much more difficult than expected. The main problem is Sn whisker formation. Sn whiskers …

It has been observed that different tin whisker growth properties can result from the same tin
deposit on two copper leadframe materials, C19400 and C70250. It was also found that …

Micro-beam Laue diffraction is an experimental method that allows the measurement of local
lattice orientation and elastic strain within individual grains of engineering alloys, ceramics …