Carrier-transport-enhanced channel CMOS for improved power consumption and performance

S Takagi, T Iisawa, T Tezuka, T Numata… - IEEE transactions on …, 2007 - ieeexplore.ieee.org
An effective way to reduce supply voltage and resulting power consumption without losing
the circuit performance of CMOS is to use CMOS structures using high carrier …

Measurement and analysis of variability in 45 nm strained-Si CMOS technology

LT Pang, K Qian, CJ Spanos… - IEEE Journal of Solid …, 2009 - ieeexplore.ieee.org
A test-chip in a low-power 45 nm technology, featuring uniaxial strained-Si, has been built to
study variability in CMOS circuits. Systematic layout-induced variation, die-to-die (D2D) …

Lateral strain profile as key technology booster for all-silicon tunnel FETs

K Boucart, W Riess, AM Ionescu - IEEE Electron Device Letters, 2009 - ieeexplore.ieee.org
In this letter, we propose a lateral asymmetric strain profile in a silicon nanowire or ultrathin
silicon film as a key technology booster for the performance of all-silicon tunnel FETs. We …

[图书][B] Strained-Si heterostructure field effect devices

CK Maiti, S Chattopadhyay, LK Bera - 2007 - taylorfrancis.com
A combination of the materials science, manufacturing processes, and pioneering research
and developments of SiGe and strained-Si have offered an unprecedented high level of …

Silicon nanowire FETs with uniaxial tensile strain

SF Feste, J Knoch, S Habicht, D Buca, QT Zhao… - Solid-State …, 2009 - Elsevier
We present experimental results on on-current and transconductance gain and mobility
enhancement in Si nanowire FETs (NW-FETs) fabricated on silicon-on-insulator (SOI) and …

Detailed simulation study of a reverse embedded-SiGe strained-silicon MOSFET

JG Fiorenza, JS Park… - IEEE Transactions on …, 2008 - ieeexplore.ieee.org
This paper presents an extensive simulation study of a MOSFET with reverse embedded-
SiGe (Rev. e-SiGe), a new strained-silicon concept that utilizes elastic relaxation of a buried …

PMOS Hole Mobility Enhancement Through SiGe Conductive Channel and Highly Compressive ILD- Stressing Layer

WS Liao, YG Liaw, MC Tang, KM Chen… - IEEE Electron …, 2007 - ieeexplore.ieee.org
In this letter, the SiGe-channel PMOS transistors integrated with a highly compressive
contact-etching stop-layer (CESL) interlayer-dielectric-SiN x stressing layer have been …

Strained SOI FinFET SRAM Design

P Kerber, R Kanj, RV Joshi - IEEE electron device letters, 2013 - ieeexplore.ieee.org
Impact of strained silicon effects in double-gated FinFET structures on static random access
memory (SRAM) cell functionality is presented. Three FinFET silicon-on-insulator (SOI) …

Hierarchical modeling of spatial variability with a 45nm example

K Qian, B Nikolić, CJ Spanos - Design for Manufacturability …, 2009 - spiedigitallibrary.org
In previous publications we have proposed a hierarchical variability model and verified it
with 90nm test data. This model is now validated with a new set of 45nm test chips. A mixed …

Stress hybridization for multigate devices fabricated on supercritical strained-SOI (SC-SSOI)

N Collaert, R Rooyackers… - IEEE electron device …, 2007 - ieeexplore.ieee.org
In this letter, we investigate the impact of a hybridized strain technology on the performance
of FinFET-based multigate field-effect transistors (MUGFETs). The technology combines the …