Lead-free solder paste printing process accounts for majority of the assembly defects in the
electronic manufacturing industry. The study investigates rheological behaviour and stencil …

Solder pastes and isotropic conductive adhesives (ICAs) are widely used as a principal
bonding medium in the electronic industry. This study investigates the rheological behaviour …

This paper describes the application of computational fluid dynamics (CFD) to simulate the
macroscopic bulk motion of solder paste ahead of a moving squeegee blade in the stencil …

The paste printing process accounts for the majority of assembly defects, and most defects
originate from poor understanding of the effect of printing process parameters on the printing …

Soldering technologies continue to evolve, particularly in the area of solder pastes used in
SMD reflow soldering. Solder pastes typically consist of solder alloy powder, flux, viscosity …

Solder paste is primarily used as a bonding medium for surface mount assemblies (SMA) in
the electronics industry. The solder paste is typically deposited using the stencil printing …

Purpose–The purpose of this paper is to develop a quality control tool based on rheological
test methods for solder paste and flux media. Design/methodology/approach–The …

Advanced electronics packaging technologies such as chip scale packages, fine pitch ball
grid arrays, and flip chip are pushing solder paste stencil printing to the limit. In order to …

This paper describes the application of advanced computational fluid dynamics (CFD)
methods to model the stencil printing process at both macroscopic and microscopic length …

The vibrating squeegee is considered by many to be one of the important developments in
solder paste printing in recent years. The use of the vibrating squeegee for stencil printing of …