[图书][B] Metrology and Diagnostic Techniques for Nanoelectronics

Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Pulsed infrared thermal imaging as inline quality assessment tool

S Panahandeh, D May, C Grosse-Kockert… - Microelectronics …, 2023 - Elsevier
Pulsed infrared thermography (PIRT) is a very fast and non-destructive technique for testing
various types of specimens. This makes PIRT interesting for 100%-inspections in industrial …

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Y Chen, Z Wang, Y Fan… - Journal of …, 2024 - asmedigitalcollection.asme.org
In a highly competitive and demanding micro-electronics market, non-destructive testing
(NDT) technology has been widely applied to defect detection and evaluation of micro …

Thermal on-board-detection of voids in the solder layer between power semiconductor and PCB

N Jahn, M Pfost - IEEE Transactions on Components …, 2023 - ieeexplore.ieee.org
In this work, a concept for the detection of defects in the solder layer between a power
semiconductor and the printed circuit board (PCB) is proposed. Four temperature sensors in …

[图书][B] Harsh environment electronics: interconnect materials and performance assessment

A Sharif - 2019 - books.google.com
Provides in-depth knowledge on novel materials that make electronics work under high-
temperature and high-pressure conditions This book reviews the state of the art in research …

Inline failure analysis of sintered layers in power modules using infrared thermography

S Panahandeh, D May… - … and Multi-Physics …, 2022 - ieeexplore.ieee.org
In this study we demonstrate the capabilities of pulsed infrared thermography (PIRT) for the
inspection of sintered and soldered chip interconnections. Furthermore, this work will …

Failure analysis of sintered layers in power modules using laser lock-in thermography

S Panahandeh, D May… - … and Multi-Physics …, 2023 - ieeexplore.ieee.org
This research focuses on the application of lock-in thermography (LIT) for inspecting
sintered chip interconnections, which are commonly used in electronic components. By …

Statistical scaling of elemental image by X-ray fluorescence spectrometry of magnesium alloy

W Matsuda, A Morikawa, A Ohbuchi, T Moriyama… - … Acta Part B: Atomic …, 2024 - Elsevier
A technique incorporating the statistical methods into colour range scale of a 2D elemental
image was developed to enable visual evaluation of significant differences in the data-a …

Detection of plated through hole defects in printed circuit board with X-ray

X Huang, S Zhu, X Huang, B Su, C Ou… - 2015 16th …, 2015 - ieeexplore.ieee.org
X-ray imaging provides direct visualization of sample's internal structures and defects.
Operation principles of two-dimensional X-ray and three-dimensional X-ray computer …

In-situ diagnosis of solder joint failure by means of thermal resistance measurement

Z Li, K Fushinobu, H Haketa, R Yasui… - Microelectronics …, 2021 - Elsevier
Solder connections provide an electrical and mechanical connection between components
and PCB (Printed Circuit Board) in electronic devices. It is very important to develop a …