[HTML][HTML] In situ observation of atomic-scale processes accomplishing grain rotation at mixed grain boundaries
A detailed monitoring of atomic-scale processes accomplishing grain rotation is important for
understanding the deformation mechanisms in nanocrystalline metals. However, direct …
understanding the deformation mechanisms in nanocrystalline metals. However, direct …
Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating
A rotary electroplating system was used to fabricate high-strength nanotwinned copper (nt-
Cu) foils with slanted columnar grain structures, which may serve as the anode current …
Cu) foils with slanted columnar grain structures, which may serve as the anode current …
[HTML][HTML] Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly< 111>-oriented nanotwinned structures
In this study, we designed and electroplated various regular and nanotwinned copper (nt-
Cu) lines. These Cu lines were then covered with a polyimide (PI) layer and heat-treated to …
Cu) lines. These Cu lines were then covered with a polyimide (PI) layer and heat-treated to …
Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
The current study presents a new microstructure of nanotwinned copper (nt-Cu) with slanted
columnar grains and its correlated mechanical properties. We deposited such nt-Cu foils via …
columnar grains and its correlated mechanical properties. We deposited such nt-Cu foils via …
Microstructure evolution during superplastic deformation process and its impact on superplastic behavior of a Mg-Gd-Y-Zn-Zr alloy
In this work, the microstructure evolution during superplastic deformation process and its
impact on superplastic behavior of a peak-aged wrought Mg-10Gd-3Y-1.5 Zn-1Zr (wt%) …
impact on superplastic behavior of a peak-aged wrought Mg-10Gd-3Y-1.5 Zn-1Zr (wt%) …
Columnar grain-driven plasticity and cracking in nanotwinned FCC metals
The mechanisms of strengthening and plasticity in columnar-grained metals with
preferentially oriented nano-sized twins have been examined traditionally by considering …
preferentially oriented nano-sized twins have been examined traditionally by considering …
Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM
Y Wu, ML Huang, SN Zhang - Materials Characterization, 2021 - Elsevier
The (111) nanotwinned copper films used as a novel under bump metallization (UBM) were
applied in micro-bump solder technology for 3D packaging. The orientation and morphology …
applied in micro-bump solder technology for 3D packaging. The orientation and morphology …
Interfacial characterization of low-temperature Cu-to-Cu direct bonding with chemical mechanical planarized nanotwinned Cu films
Copper-to-copper (Cu-to-Cu) direct bonding is a promising approach to replace traditional
solder joints in three-dimensional integrated circuits (3D ICs) packaging. It has been …
solder joints in three-dimensional integrated circuits (3D ICs) packaging. It has been …
Stress relaxation and grain growth behaviors of (111)-preferred nanotwinned copper during annealing
Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for
thermal-stress characterization. We tailored the microstructural features (grain scale and …
thermal-stress characterization. We tailored the microstructural features (grain scale and …
Thermal and compositional fields to maneuver Cu6Sn5 intermetallic growth on (111) nanotwinned copper substrate
Z Zhang, H Wei, X Gao, A Kunwar - Journal of Alloys and Compounds, 2024 - Elsevier
The microstructure of the Cu 6 Sn 5 phase plays a pivotal role in the functionality of
microbumps utilized in 3D packaging. In this study, we present an experimental …
microbumps utilized in 3D packaging. In this study, we present an experimental …