Reliability issues of lead-free solder joints in electronic devices
N Jiang, L Zhang, ZQ Liu, L Sun, WM Long… - … and technology of …, 2019 - Taylor & Francis
Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …
which undoubtedly puts forward higher requirements for the reliability of solder joints in …
Structure and properties of lead-free solders bearing micro and nano particles
L Zhang, KN Tu - Materials Science and Engineering: R: Reports, 2014 - Elsevier
Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …
Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints
X Hu, T Xu, LM Keer, Y Li, X Jiang - Materials Science and Engineering: A, 2016 - Elsevier
The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0. 5Cu/Cu
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …
Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets
G Chen, F Wu, C Liu, VV Silberschmidt… - Journal of Alloys and …, 2016 - Elsevier
Highlights•Ni-coated graphene (Ni-GNS) composite reinforcement was prepared by
electroless plating method.•Ni-GNS/SAC305 composite solders were further prepared …
electroless plating method.•Ni-GNS/SAC305 composite solders were further prepared …
Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8 Ag–0.7 Cu lead-free solder and copper substrate
This paper reports on the effects of adding Ni nanoparticles to a Sn–3.8 Ag–0.7 Cu solder.
The nanocomposite was prepared by manual blending of SAC solder paste with various …
The nanocomposite was prepared by manual blending of SAC solder paste with various …
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging
Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …
the properties of the solder. In this study, interface reaction mechanism during thermal …
Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5 Ag–0.5 Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
LC Tsao - Journal of Alloys and Compounds, 2011 - Elsevier
This study investigated the effects of adding 0.5 wt.% nano-TiO2 particles into Sn3. 5Ag0.
5Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu …
5Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu …
First-principles calculations on wetting interface between Ag-Cu-Ti filler metal and SiC ceramic: Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface
J Yang, Z Ye, J Huang, S Chen, Y Zhao - Applied Surface Science, 2018 - Elsevier
Abstract Interfacial properties of Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1)
interface were researched by first-principles calculations to investigate the reason that Ag …
interface were researched by first-principles calculations to investigate the reason that Ag …
Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
H He, S Huang, Y Ye, Y Xiao, Z Zhang, M Li… - Journal of Alloys and …, 2020 - Elsevier
In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening
phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based …
phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based …
Development of SnAg-based lead free solders in electronics packaging
L Zhang, C He, Y Guo, J Han, Y Zhang… - Microelectronics …, 2012 - Elsevier
Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …
concerns regarding toxicity of lead and, more importantly, by the perceived economic …