A semiconductor integrated circuit device includes a substrate; a transistor on the substrate;
an interlayer insulating film on the transistor; an insulating liner on the interlayer insulating …

A semiconductor device includes a conductive pattern formed over a semiconductor
substrate, and an interconnect structure formed over the conductive pattern. The …

A semiconductor device comprises a fin disposed on a substrate, a source/drain feature
disposed over the fin, a silicide layer disposed over the source/drain feature, a seed metal …

H01L23/522—Arrangements for conducting electric current within the device in operation
from one component to another, ie interconnections, eg wires, lead frames including …

Techniques to enable bottom barrier free interconnects without voids. In one aspect, a
method of forming interconnects includes: forming metal lines embedded in a dielectric; …