Understanding on the creep behavior of fiber reinforced polymer via fiber/matrix interaction
The interfacial interaction between fiber and matrix is believed as one of the key parameters
that affects viscoelastic response of different types of fiber reinforced polymer (FRP) …
that affects viscoelastic response of different types of fiber reinforced polymer (FRP) …
An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations
In this study, a coarse-grained model is developed to describe the interatomic interactions
between a cross-linked epoxy and a copper substrate. Based on this model, the tensile …
between a cross-linked epoxy and a copper substrate. Based on this model, the tensile …
Interfacial Integrity of Carbon Fiber/Epoxy Matrix Interface Under Loading Conditions
In this chapter, molecular dynamics (MD) simulation is used to investigate the molecular
interactions and behaviors of carbon fiber/epoxy interface under different loading conditions …
interactions and behaviors of carbon fiber/epoxy interface under different loading conditions …
Degradation of Carbon Nanofiber-Reinforced Composite Under Loading and Environmental Conditions
This chapter concentrates on the MD simulation of carbon nanofiber-reinforced composites,
with the focus on the molecular interactions, structures, and properties under different …
with the focus on the molecular interactions, structures, and properties under different …
Electrochemical assembly and molecular dynamics simulation of SAM on copper for epoxy/copper adhesion improvement
SCT Kwok, MMF Yuen - 2013 IEEE 15th Electronics Packaging …, 2013 - ieeexplore.ieee.org
This work reports on adhesion enhancement effects of self-assembled organothiol treatment
on copper (Cu)/epoxy interface, as well as a significant reduction in treatment time under the …
on copper (Cu)/epoxy interface, as well as a significant reduction in treatment time under the …
Multi-scale Modeling of Polymer/Metal Interface
S Yang - 2014 - search.proquest.com
High-density circuits which involve multi-material integration have been extensively adopted
in electronic packaging designs, in order to meet the requirements by recent portable …
in electronic packaging designs, in order to meet the requirements by recent portable …
Molecular dynamics simulation of adhesion performance and conformation transition of SAM-modified Cu/Epoxy interface under electric field
SCT Kwok, MMF Yuen - 2014 15th International Conference on …, 2014 - ieeexplore.ieee.org
This work aims to investigate the conformational transition of self-assembled monolayer
(SAM) on copper (Cu) under influence of different electrical field strength through molecular …
(SAM) on copper (Cu) under influence of different electrical field strength through molecular …