Lead-free solder paste printing process accounts for majority of the assembly defects in the
electronic manufacturing industry. The study investigates rheological behaviour and stencil …

Although stencil printing is widely used in surface mount technology, it is believed to be the
main source of majority of defects in the final assembly. Such defects, which could lead to …

Purpose–The purpose of this paper is to comprehensively explore the effects of critical
parameters on solder deposition and to establish a systematic approach for determining …

The thixotropic behaviour of different type lead-free solder pastes (Type 3: particle size: 20–
45 μm; Type 4: 20–38 μm; Type 5: 10–25 μm) was investigated and compared. The viscosity …

Increased functional density and reduced input/output (I/O) spacing are the market trends in
the electronics manufacturing industry. Industry reports indicate that approximately 50 …

Wall-slip plays an important role in the flow behaviour of solder paste materials. The wall-
slip arises due to the various attractive and repulsive forces acting between the solder …

Reflow soldering process is widely implemented in the electronics industry. This method
allows the attachment of electronic components to a printed circuit board (PCB) through the …

Purpose–The purpose of this paper is to suggest an analysis methodology for the stencil
printing process and to obtain proper design parameters that guarantee the successful filling …

Purpose A measurement method has been developed to reveal the viscosity change of
solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour …

Abstract Sn-Ag-Cu solder pastes are widely used as the joining material in the electronic
assembly process. The aim of this work was to evaluate the nonlinear viscoelastic behaviors …