Kerf-free wafering: Technology overview and challenges for thin PV manufacturing

FJ Henley - 2010 35th IEEE Photovoltaic Specialists …, 2010 - ieeexplore.ieee.org
Eliminating high absorber material loss while allowing thin and ultra-thin crystalline silicon
PV has been a “Holy Grail” of the crystalline silicon PV industry for decades. Generally …

Crystalline thin‐foil silicon solar cells: where crystalline quality meets thin‐film processing

F Dross, K Baert, T Bearda, J Deckers… - Progress in …, 2012 - Wiley Online Library
ABSTRACT Crystalline Si (c‐Si) technology is dominating the photovoltaics market. These
modules are nonetheless still relatively expensive, in particular because of the costly silicon …

Experimental study of the cutting performance of free-abrasive wire sawing in a magnetic field

T Qiu, C Yao, W Zhang, C Tang, W Peng… - The International Journal …, 2016 - Springer
In view of the low cutting efficiency and large kerf loss of traditional free-abrasive wire
sawing, a method of free-abrasive wire sawing in a magnetic field is proposed. Magnetic …

[PDF][PDF] Reaching a kerf loss below 100 μm by optimizing the relation between wire thickness and abrasive size for multi-wire sawing

M Schumann, M Singh, TO Pérez… - Proceedings of the 24th …, 2009 - scholar.archive.org
Multi-wire sawing is to date by far the most common method to produce wafers from
crystallized silicon bricks. A lot of research is undertaken to reduce the kerf to minimize the …

Adsorption mechanism of magnetic induction free-abrasive grain and its effect on cutting performance of wire saws

W Peng, T Qiu, C Yao, C Tang, W Zhang - International journal of precision …, 2015 - Springer
This paper proposes a method of free-abrasive wire sawing in the magnetic field. Magnetic
abrasive grains are absorbed on surface of the wire by magnetic force, and therefore more …

[PDF][PDF] First demonstration of high volume manufacturing of kerf-free polymax wafers

A Brailove, S Kang, A Fujisaka, F Henley - Proc. of the 25th European …, 2010 - sigen.com
A novel kerfless wafer-making process has been developed and introduced over the last
several years. The PolyMax™ process is based on ion beam-induced cleaving of crystalline …

[HTML][HTML] Kerfless Si Wafering Using Al Metal Paste, Epoxy and Ni Electroplating as Stress-Induced Layer

YJ Cho, HS Chang - Korean Journal of Metals and Materials, 2022 - kjmm.org
Kerfless wafering is a beneficial technique that enhances the cost effectiveness of crystalline
silicon (c-Si) solar cells, preventing silicon (Si) waste during diamond sawing. This study …

[PDF][PDF] Etude des propriétés physico-chimiques du matériau de siliciumquasi-mono (mono-like): traitementschimiques pour application photovoltaïque

G Benseba - 2020 - ummto.dz
Le silicium mono-like (Quasi-mono) est une nette amélioration de la qualité cristalline du
silicium multicristallin. Un pavage de silicium au fond des fours de cristallisation (technique …

[PDF][PDF] 저비용태양에너지전환소자를위한균열기반박막분리기술

김수민, 김준희, 송희은, 이용환, 오지훈 - 세라미스트, 2020 - ceramist.or.kr
Abstracts Recently, there has been an increasing demand for environmentally friendly
renewable energy as an alternative to fossil fuels. Among the renewable energy sources …

[引用][C] 磁场方向对磁性磨粒的动力学特性及切缝宽度影响的研究

张威, 许雪峰, 姚春燕, 李贺杰, 刘坤 - 太阳能学报, 2018