In this study, the barrier properties and diffusion behavior of carbon-doped Cu (Ni) alloy film
were investigated. The films were fabricated using magnetron sputtering on a barrierless …

Electromigration (EM) has been a pivotal reliability challenge for interconnects, but there are
only few studies on EM in Cu–Cu joints. In this work, accelerated EM tests for the Cu–Cu …

In this study, we developed a Mo metal thin film deposition process consisting of two steps:
Mo2N thin film deposition using plasma-enhanced atomic layer deposition, followed by …

We present a methodology for numerically evaluating grain boundary scattering in
polycrystalline molybdenum (Mo) thin films. Two types of Mo films (an epitaxially grown …

The plasma atomic layer etching (ALE) process for Ru was developed with surface
fluorination and ion bombardment. We employed two methods for surface fluorination:(i) …

We investigated the training dependency of neural network interatomic potentials for
molecular dynamics simulation of a Ru–Si–O mixed system. Our neural network interatomic …

We apply a compact model for electromigration (EM) to study the build-up of vacancy-
induced stress in a buried power rail (BPR) for vertically stacked complementary field-effect …