The issue of stress in thin films and functional coatings is a persistent problem in materials
science and technology that has congregated many efforts, both from experimental and …

We have studied the relationship between the structure and the spin Hall angle of the early
5d transition metals in X/CoFeB/MgO (X= Hf, Ta, W, and Re) heterostructures. Spin Hall …

Manipulating the interfacial structure is vital to enhancing the interfacial thermal
conductance (G) in Cu/diamond composites for promising thermal management …

Sputter-deposited W films with nominal thicknesses between 5 and 180 nm were prepared
by varying the base pressure prior to film deposition and by including or not including …

Thin films of β-W are the most interesting for manipulating magnetic moments using spin–
orbit torques, and a clear understanding of α to β phase transition in W by doping impurity …

We report the creation of an unusual simple cubic-phase W100 nanorods with a pyramidal
tip having four 110 facets using an oblique-angle sputter deposition technique with substrate …

We report the systematic dependence of spin pumping in tungsten (W)/CoFeB
heterostructures on the structural phase of W, which is intricately related to argon gas …

In this work, the deposition of tungsten (W) films by High Power Impulse Magnetron
Sputtering (HiPIMS) has been investigated. By adopting a combined modeling and …

The continuous scaling of copper (Cu) interconnects produced two major shortcomings–a
severe resistivity size effect and material reliability issues. Tungsten (W), with the expected …

Middle-of-the-line (MOL) interconnect and contact resistances represent significant impacts
to high-end IC performance at≤ 10 nm nodes. CVD W-based metallization has been used …