For the past couple of decades, a considerable amount of time and effort has been spent to
enhance the predictability of warpage of semiconductor packages encapsulated by epoxy …

The thermal mismatch between different components has been a serious issue in the
reliability of electronic products. The effect of epoxy molding compound (EMC) on the …

This paper focuses on characterizing the evolution of warpage, effects of epoxy molding
compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL …

This article aims to characterize the warpage evolution of fan-out wafer-level packaging
(FOWLP) during the wafer-level mold cure process. A finite-element analysis (FEA)-based …

High-density interconnect (HDI) printed circuit boards (PCBs) are in high demand for
smartphones, particularly those with fifth generation (5G) functionality, due to their smaller …

The present study deals with the investigation of compression mold processes and materials
to enable a highdensity chip-first multi-die Fan-Out assembly. Wafer warpage, die shift and …

Build-up process is a highly effective for high-density integration of printed circuit boards.
Ajinomoto Build-up Film®(ABF) has become world-wide used insulation build-up material …

In decades of microelectronic devices manufacturing, a few generations of epoxy molding
compounds (EMCs) have been developed and applied successfully in different packaging …

Due to the significant volume change of molding compounds during assembly processes,
warpage is the top issue to be overcome in the application of the fan-out wafer form …

The molded underfill (MUF) offers many unique advantages, including lower material costs,
higher throughput, and excellent reliability for flip-chip chip scale packages (fcCSP) and fan …