JY Lee, MS Lin - US Patent 10,957,679, 2021 - Google Patents
H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices; Multistep manufacturing processes thereof the devices being of types …
JY Lee, MS Lin - US Patent 10,608,642, 2020 - Google Patents
G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor …
JY Lee, MS Lin - US Patent 10,447,274, 2019 - Google Patents
H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, ie interconnections, eg wires, lead frames the …
MS Lin, JY Lee - US Patent 10,489,544, 2019 - Google Patents
A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the …
MS Lin, JY Lee - US Patent 10,523,210, 2019 - Google Patents
(57) ABSTRACT A multi-chip package includes a field-programmable-gate array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table …
JY Lee, MS Lin - US Patent 10,608,638, 2020 - Google Patents
(60)(57) ABSTRACT Related US Application Data Provisional application No. 62/675,785, filed on May 24, 2018, provisional application No. 62/729,527, filed on Sep. 11, 2018 …
MS Lin, JY Lee - US Patent 10,892,011, 2021 - Google Patents
G11C14/0054—Digital stores characterised by arrangements of cells having volatile and non-volatile storage properties for back-up when the power is down in which the volatile …
E Pikhay, Y Roizin - US Patent 7,859,043, 2010 - Google Patents
(57) ABSTRACT A three terminal non-volatile memory (NVM) cell for a CMOS IC is formed by a standard CMOS process? oW. The NVM cell includes tWo transistors that share a …