Age-hardened 6201 aluminum alloy wires utilized in high-voltage transmission lines need to
have high strength, high conductivity and high ductility. However, simultaneously obtaining …

TSV-Cu is widely used for chip interconnects, where high testing costs and complex crystal
plasticity finite element (CPFE) limit the research of its deep microplastic evolution process …

In this research, 90% asymmetric unidirectional rolling and post‐annealing are applied to
electrolytic tough‐pitch (ETP) copper. The effect of low‐temperature (200° C) annealing on …

In this study, the microstructure and properties evolution of Cu-2.7 Ti-0.2 Fe alloy (wt.%)
during cold drawing and subsequent aging treatment were investigated. The grain …

In space flexible solar arrays, stranded Ag-plated Cu conductors and Ag interconnectors are
preferred materials for energy transmission. Parallel gap resistance welding is a solderless …

Abstract In this study, Cu@ Mo composite powders, prepared using an electroless plating
method, were applied to synthesize Mo70Cu30 composites using infiltration sintering and …

The design freedom offered by additive manufacturing opens up possibilities for developing
novel vacuum electronic devices and radio-frequency components with integrated …

Copper, though highly conductive, requires improved wear resistance and thermal
dissipation in applications that involve continuous movement and current-induced …

This study aims to enhance the electrical conductivity of commercially pure aluminium by
minimizing impurities and grain boundaries in its microstructure, ultimately improving the …

In the present work, a new strategy combining the solvo-hydrothermal method with
microwave sintering (MWS) technique was successfully employed to synthesize single …