The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated.
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …

Die stacking enables significant performance leaps in computing capability and
memory/processor integration. Conventional die stacking uses solder interconnects which …

In this paper, we holistically discuss the recent design, wafer fabrication and die assembly
changes needed to enable hybrid bonding interconnect (HBI) on Intel process. HBI enables …

As semiconductor device scaling faces a severe technical bottleneck, vertical die stacking
technologies have been developed to obtain high performance, high density, low latency …

We propose an integrated photonic circuit that acts as an optical coherent Ising machine and
simulates its performance on the basis of some example problems. In contrast to previous all …

To achieve fine-pitch, SOC-like I/O communication, and to realize heterogeneous
integration, die-to-wafer (D2W) hybrid bonding (HB) is being investigated extensively. HB is …

There are at least five different chiplet design and heterogeneous integration packaging,
namely (1) chip partition and heterogeneous integration (driven by cost and technology …

Xtacking™ is a novel 3D (three-dimensional) NAND flash architecture, in which memory
cells and peripheral circuits are bonded by millions of pairs of small-pitch metal vias …

Die-to-wafer direct hybrid bonding process is foreseen as a key enabler of heterogeneous
3D integration. Hybrid bonding technologies were first developed on W2W assembly …