In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV) interposers will be investigated. Emphasis is …

Abstract As Moore's Law comes to an end, the implementation of high-performance chips
through transistor scaling has become increasingly challenging. To improve performance …

Organic interposer (CoWoS-R) technology is one of the most promising heterogeneous
integration platforms for high performance computing (HPC) applications. Components such …

In this study, the fan-out chip-last panel-level packaging method in fabricating an ultralarge
organic interposer of a hybrid substrate for heterogeneous integration is investigated …

High performance computing (HPC) is essential to applications like big data analysis,
artificial intelligence, and cloud computing. Products like autonomous vehicles, edge …

Flip chip is one of the chip-level interconnects and has been used for highperformance and
high-density applications such as central processing unit, graphic processing unit, and …

Interposer technology is successfully adopted for heterogeneous and chiplet integration
because of its advantages in electrical performance, warpage control, yield and reliability …

A panel-based large-scale redistribution-layer (RDL) interposer has been fabricated using a
2-μm-pitch semi-additive process. A key technology in the panel-based processing is dry …

The hybrid substrate (build-up package substrate+ organic interposer+ solder joints+
underfill) of 2.3 D IC integration (or multiple systems and heterogeneous integration) is …