Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …

Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …

Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …

Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …

Solder joints in electronic assemblies are subjected to mechanical cycling in normal
operating conditions. Testing individual solder joint in mechanical cycling allows monitoring …

The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder
alloys with doped elements such as Bi and Sb is one of the candidates for high reliability …

The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

The reliability of an electronic assembly is typically limited by the failure of one of the solder
interconnections. One of the key factors that define the quality of solder interconnections is …

Solder alloy materials are utilized to form mechanical and electrical connections between
printed circuit boards and the electronic components. Enhancing the reliability of the …

A thermal fatigue life prediction model of microelectronic chips based on thermal fatigue
tests and solder/substrate interfacial singularity analysis from finite element method (FEM) …