The evolution of silicon cryoetching is reported in this topical review, from its very first
introduction by a Japanese team to today's advanced technologies. The main advances in …

The developments in advanced interconnect technology for semiconductor logic devices for
the mitigation of plasma‐induced damage to low‐dielectric‐constant (low‐k) materials …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Hyperconnected network architectures can endow nanomaterials with remarkable
mechanical properties that are fundamentally controlled by designing connectivity into the …

Oxygen atmospheric plasma was used to pretreat polycarbonate (PC) and stretched poly
(methyl methacrylate)(PMMA) surfaces in order to enhance the adhesion of the dense silica …

Mesoporous coatings are widely used in industries such as optics, display technologies,
photovoltaics, and bioengineering, due to their attractive properties such as high surface …

The etch mechanism of porous SiOCH-based low-k films by F atoms is studied. Five types of
ultra-low-k (ULK) SiOCH films with k-values from 1.8 to 2.5 are exposed to F atoms in the far …

Hyperconnected hybrid organosilicate glass networks formed by hyperstiff precursor
molecules with certain geometrical characteristics can lead to exceptional elastic properties …

This paper describes an approach for the reduction of plasma-induced damage in self-
assembly based porous ultra low-k organosilica dielectrics. The concept is based on …

The micro-capillary condensation of a new high boiling point organic reagent (HBPO), is
studied in a periodic mesoporous oxide (PMO) with∼ 34% porosity and k-value∼ 2.3. At a …