Comparison of copper-based composites fabricated by cross-accumulative roll bonding method for packaging design
Y Wei, D Ran, Y Piri, M Zandi… - Materials Science and …, 2024 - journals.sagepub.com
Copper-based composites have interesting properties and they are widely used in
electronics, packaging, and automotive applications. In the present work, the cross …
electronics, packaging, and automotive applications. In the present work, the cross …