A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a
substrate accurately and uniformly. The polishing apparatus includes a rotary holding …

The polishing apparatus has a polishing unit capable of forming a right-angled cross section
by polishing a peripheral portion of the substrate. The polishing unit includes a polishing …

The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the
substrate to form a right-angled cross section. The polishing apparatus includes: a substrate …

(57) ABSTRACT A method for manufacturing a semiconductor devicemakes it possible to
efficiently polish with a polishing tape a peripheral portion of a silicon Substrate under …

US8641480B2 - Polishing apparatus and polishing method - Google Patents
US8641480B2 - Polishing apparatus and polishing method - Google Patents Polishing …

A substrate processing method which can clean a peripheral portion of a substrate after
polishing and can check the cleaning effect of the peripheral portion of the substrate is …

A polishing method can obtain a good polishing profile which, for example, will not cause
peeling of a semiconductor layer from a silicon substrate. The polishing method includes …

A method for manufacturing a semiconductor device makes it possible to efficiently polish
with a polishing tape a peripheral portion of a silicon substrate under polishing conditions …

(57) ABSTRACT A Substrate polishing method includes starting to rotate a circular substrate
and polishing an inner peripheral edge Sur face of a center circular hole formed in the …

A polishing apparatus includes a substrate holder configured to hold and rotate a substrate,
a press pad configured to press a polishing tape having a polishing surface against a bevel …