Hybrid laser and plasma etch wafer dicing using substrate carrier
S Singh, B Eaton, A Kumar, WS Lei, JM Holden… - US Patent …, 2014 - Google Patents
11, 2003 1, 2004 2, 2004 3, 2004 T/2004 10, 2004 5/2005 2, 2006 10, 2006 10, 2006 2,
2007 9, 2007 4, 2008 10, 2008 12, 2008 12, 2008 1/2009 3, 2009 12, 2009 3, 2010 3, 2010 …
2007 9, 2007 4, 2008 10, 2008 12, 2008 12, 2008 1/2009 3, 2009 12, 2009 3, 2010 3, 2010 …
Method of die singulation using laser ablation and induction of internal defects with a laser
JS Papanu, WS Lei, J Park, A Lerner, B Eaton… - US Patent …, 2015 - Google Patents
Zafman LLP (57) ABSTRACT A method and system of hybrid laser dicing are described. In
one embodiment, a method includes focusing a laser beam inside a Substrate in regions …
one embodiment, a method includes focusing a laser beam inside a Substrate in regions …
Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device
Y Asano, K Higuchi, T Tomioka, T Iguchi - US Patent 10,410,976, 2019 - Google Patents
A method of manufacturing a semiconductor chip according to an embodiment includes
forming on a semiconductor substrate a plurality of etching masks each including a …
forming on a semiconductor substrate a plurality of etching masks each including a …
Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
RC Nangoy - US Patent 9,196,498, 2015 - Google Patents
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality
of integrated circuits, are described. In an example, a plasma processing apparatus includes …
of integrated circuits, are described. In an example, a plasma processing apparatus includes …
Plasma processing apparatus and method therefor
S Okita - US Patent 9,620,336, 2017 - Google Patents
The present invention has an object to improve both the plasma process performance and
the electrostatic attraction performance in a plasma processing apparatus for plasma …
the electrostatic attraction performance in a plasma processing apparatus for plasma …
Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device
Y Asano, K Higuchi, T Tomioka, T Iguchi - US Patent 9,460,967, 2016 - Google Patents
A method of manufacturing a semiconductor chip according to an embodiment includes
forming on a semiconductor substrate a plurality of etching masks each including a …
forming on a semiconductor substrate a plurality of etching masks each including a …
Plasma thermal shield for heat dissipation in plasma chamber
AH Ouye - US Patent 9,293,304, 2016 - Google Patents
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality
of integrated circuits, are described. In an example, a plasma thermal shield for a plasma …
of integrated circuits, are described. In an example, a plasma thermal shield for a plasma …
Method for insulating singulated electronic die
FJ Carney - US Patent 9,385,041, 2016 - Google Patents
In one embodiment, a method of forming an electronic device includes providing a wafer
having plurality of die separated by spaces. The method includes plasma singulating the …
having plurality of die separated by spaces. The method includes plasma singulating the …
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality
of integrated circuits, are described. In an example, a method ofdicing a semiconductor …
of integrated circuits, are described. In an example, a method ofdicing a semiconductor …
Method of manufacturing element chip and method of manufacturing electronic component-mounted structure using plasma etch to singulate element chip
A Harikai, S Okita, N Matsubara - US Patent 9,698,052, 2017 - Google Patents
In a method of manufacturing an element chip for manufacturing a plurality of element chips
by dividing a substrate, where the protruding portions, which are exposed element …
by dividing a substrate, where the protruding portions, which are exposed element …