The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

Herein, the influence of alloying bismuth (Bi) and aluminum (Al) on the corrosion
performance of Sn single bond 9Zn in a 3.5% NaCl solution was examined. Electrochemical …

The effect of Sn alloying (0.5, 1.0, 2.0 wt.%) on microstructure and corrosion behavior of
dilute Mg-2Zn-xSn-0.5 Ca rolled sheets is illuminated. The corrosion resistance first …

Microstructural modification and mechanical strength enhancement of lead-free Sn–Ag–Cu
solder alloys using reinforcing particles have been a focus of the researcher's attention. In …

Nowadays, the development and improvement of physical and mechanical properties of
lead-free solders have become a topic of interest for researchers, because the use of lead …

In electronics assembly, solder joints not only serve as mechanical supporters-, but also as
heat removers. Therefore, solder joint reliability is a major concern not only during …

Improving mechanical properties of solder alloy can result in a decrease of its conductivity.
The decrease in conductivity of the solder increases the generation of Joule heat and …

This paper elucidates the influence of dimple-microtextured copper substrate on the
performance of Sn-0.7 Cu solder alloy. A dimple with a diameter of 50 µm was produced by …

The application of Sn-0.7 Cu solder in electronic packaging is limited by its high melting
point, low wettability, and poor solderability. Herein, we obtain Co nanoparticles embedded …

1254 ОВ СЕРЕДЕНКО, ВО СЕРЕДЕНКО сенні покриттів, спрей-процесі тощо) й
поодиноких крапель (адитивних технологіях, змочуванні мікрооб'єктів тощо), а також …