Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Y Chen, Z Wang, Y Fan… - Journal of …, 2024 - asmedigitalcollection.asme.org
In a highly competitive and demanding micro-electronics market, non-destructive testing
(NDT) technology has been widely applied to defect detection and evaluation of micro …

Bridge scour monitoring based on active heating and temperature measurement method

H He, W Li, Y Huang, J Zhu, X Zhao… - Structural Health …, 2024 - journals.sagepub.com
Bridge scour has always been one of the main threats to bridge safety. Since bridge
collapse caused by scour occurs relatively sudden, it is necessary to monitor the scour of …

Online die temperature measurement using S-parameters in GaN-based power converters

Y Pascal, F Daschner, S Mönch, M Liserre… - Microelectronics …, 2023 - Elsevier
Die temperature (T j) measurement of GaN HEMTs is of high interest to enable reducing
design margin and the implementation of reliability driven control schemes and protections …

Non-Destructive Testing (NDT) Method for reliability assessment of Power Electronic Modules

A Gopishetti - 2023 - theses.hal.science
The embedded systems implemented in aerospace, transport, and power converters led to
the development of modules using SiC and GaN semiconductors today. Integrating new …