Advancements in energy efficient GaN power devices and power modules for electric vehicle applications: a review

RT Yadlapalli, A Kotapati, R Kandipati… - … Journal of Energy …, 2021 - Wiley Online Library
The third generation wide bandgap (WBG) semiconductor materials exhibit a prominent role
in various applications such as adapters, uninterrupted power supplies, smart grids, and …

The 2018 GaN power electronics roadmap

H Amano, Y Baines, E Beam, M Borga… - Journal of Physics D …, 2018 - iopscience.iop.org
Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to
facilitate economic growth in a semiconductor industry that is silicon-based and currently …

Multi-Channel Monolithic-Cascode HEMT (MC2-HEMT): A New GaN Power Switch up to 10 kV

M Xiao, Y Ma, Z Du, V Pathirana… - 2021 IEEE …, 2021 - ieeexplore.ieee.org
This work presents a new device concept, the Multi-Channel Monolithic-Cascode high-
electron-mobility transistor (MC 2-HEMT), which monolithically integrates a low-voltage …

Accurate Measurement of Dynamic on-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter

K Li, A Videt, N Idir, PL Evans… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Because of trapped charges in GaN transistor structure, device dynamic on-state resistance
R_DSon is increased when it is operated in high frequency switched power converters, in …

Wafer-scale Si–GaN monolithic integrated E-mode cascode FET realized by transfer printing and self-aligned etching technology

J Zhang, W Zhang, Y Wu, Y Zhang… - … on Electron Devices, 2020 - ieeexplore.ieee.org
In this article, Si (100) inks' array is integrated on SiN/AlGaN/GaN substrate to demonstrate a
zero deviation and wafer-scale Si-GaN monolithic integration by transfer printing and self …

Comprehensive study on switching behavior of cascode GaN under the influence of gate driver

B Luo, G Luo, S Li - CSEE Journal of Power and Energy …, 2023 - ieeexplore.ieee.org
With the high-frequency, low power dissipation and high-efficiency characteristics, Gallium
nitride (GaN) power devices are of significant benefits to design high-speed motor drives in …

Effect of P-Type GaN Buried Layer on the Temperature of AlGaN/GaN HEMTs

H Lv, Y Cao, M Ma, Z Wang, X Zhang, C Chen, L Wu… - Micromachines, 2023 - mdpi.com
In this paper, a P-type GaN buried layer is introduced into the buffer layer of AlGaN/GaN
HEMTs, and the effect of the P-type GaN buried layer on the device's temperature …

[PDF][PDF] Analysis of performance and reliability of sub-kV SiC and GAN cascode power electronic devices

Y Gunaydin - 2023 - researchgate.net
The energy is one of the main infrastructures for human life and industries. Therefore, many
studies have been investigated on energy resources, and especially, lots of renewable …

E-mode All-GaN-Integrated cascode MISHEMT with GaN/InAlGaN/GaN backbarrier for high power switching performance: Simulation study

P Singh, V Kumari, M Saxena, M Gupta - Micro and Nanostructures, 2022 - Elsevier
In this work, simulation-based research work based on a novel All-GaN-Integrated Cascode
(AGC) MISHEMT with quaternary layer In y Al x Ga 1-xy N as backbarrier has been …

I–V characteristics of graphene nanoribbon/h-BN heterojunctions and resonant tunneling

T Wakai, S Sakamoto, M Tomiya - Journal of Physics: Condensed …, 2018 - iopscience.iop.org
We present the first principle calculations of the electrical properties of graphene sheet/h-BN
heterojunction (GS/h-BN) and 11-armchair graphene nanoribbon/h-BN heterojunction (11 …