We analyze the electrical coupling effect of a fork-shaped field-effect transistor (FSFET) and
compare FSFET and the nanosheet FET (NSFET) in terms of logic cell power, performance …

Monolithic-3D-integration (M3D) improves the performance and energy efficiency of 3D ICs
over conventional through-silicon-vias-based counterparts. The smaller dimensions of …

In this study, the electrical characteristics and electrical coupling effect for monolithic 3-
dimensional nonvolatile memory consisting of a feedback field-effect transistor (M3D-NVM …

The optimal structure and process for the feedback field-effect transistor (FBFET) to operate
as a logic device are investigated by using a technology computer-aided design mixed …

In order to simulate a circuit by applying various logic circuits and full chip using the HSPICE
model, which can consider electrical coupling proposed in the previous research, it is …

We studied low temperature (< 250° C) transfer of 8 in. full sized thin Si wafer layer on the
SiO 2/Si substrate without any wafer flip up/down and subsequent high temperature process …

A monolithic three-dimensional integrated static random access memory containing a
feedback field effect transistor (M3D-FBFET-SRAM) was proposed. The M3D-FBFET-SRAM …

Monolithic three-dimensional (M3D) logics such as M3D-NAND, M3D-NOR, M3D-buffer,
M3D 2× 1 multiplexer, and M3D D flip-flop, consisting of modularized M3D inverters (M3D …

An equivalent circuit model of monolithic 3-D inverter (M3INV) considering the electrical
coupling between the stacked metal-oxide-semiconductor field-effect transistors (MOSFETs) …

We have simulated a monolithic three-dimensional inverter (M3DINV) structure by
considering the interfacial trap charges generated thermally during the monolithic three …