Millimeter-Wave Bandpass Filters Using On-Chip Dual-Mode Resonators in 0.13-μm SiGe BiCMOS Technology

Y Liu, KD Xu - IEEE Transactions on Microwave Theory and …, 2023 - ieeexplore.ieee.org
A novel on-chip dual-mode resonator (OCDMR) is proposed for the design of millimeter-
wave (mm-wave) bandpass filters (BPFs). The proposed OCDMR consists of a stub-loaded …

Millimeter-wave on-chip bandpass filter using complementary-broadside-coupled structure

KD Xu, Y Liu - IEEE Transactions on Circuits and Systems II …, 2023 - ieeexplore.ieee.org
A new millimeter-wave on-chip bandpass filter (BPF) using complementary-broadside-
coupled (CBC) structure is presented. The transmission zeros (TZs) of the proposed BPF are …

Frequency-and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs

WS Zhao, WY Yin, XP Wang… - IEEE transactions on …, 2011 - ieeexplore.ieee.org
Temperature-dependent investigations of circular and square coaxial through-silicon vias (C-
TSVs) are carried out in this paper, which can provide an effective solution to suppressing …

An extension of partial element equivalent circuit method for frequency selective surface analysis

ZX Wang, PC Zhao, ZY Zong, W Wu… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
In this communication, an extension of a partial element equivalent circuit (PEEC) method
for frequency selective surfaces (FSSs) modeling is presented. Based on Floquet's theorem …

Millimeter-wave bandpass filter based on spiral resonators and DGS using SiGe BiCMOS technology

Y Liu, X Weng, KD Xu - … Transactions on Circuits and Systems II …, 2023 - ieeexplore.ieee.org
A new ultra-compact millimeter-wave on-chip bandpass filter (BPF) is presented based on
two spiral resonators and a defected ground structure (DGS). For investigating the working …

Particle formation using sub-and supercritical fluids

Ž Knez, M Škerget, MK Hrnčič, D Čuček - Supercritical Fluid Technology for …, 2014 - Elsevier
Applying supercritical fluids may overcome the drawbacks of several conventional
processes for formulation of products. For production of particles with micron and submicron …

Electrothermal effects in high density through silicon via (TSV) arrays

WS Zhao, XP Wang, WY Yin - Progress In Electromagnetics Research, 2011 - jpier.org
Electrothermal effects in various through silicon via (TSV) arrays are investigated in this
paper. An equivalent lumped-element circuit model of a TSV pair is derived. The …

Laser-based fabrication of microstructures on nickel thin films and its applications in on-chip thin film inductors

S Itapu, V Borra, DG Georgiev - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
This work reports on the fabrication of microbump structures on nickel (Ni) films by single-
pulse, localized laser irradiation. Conditions for the reproducible formation of such …

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

WS Zhao, XP Wang, XL Xu… - 2010 IEEE Electrical …, 2010 - ieeexplore.ieee.org
An equivalent lumped-element circuit model of coaxial TSV is proposed in this paper, in
which both frequency-and temperature-dependent elements are extracted using the partial …

Modeling of a pair of annular through silicon vias (TSV)

XL Xu, WS Zhao, WY Yin - 2011 IEEE Electrical Design of …, 2011 - ieeexplore.ieee.org
Modelling of a pair of annular TSVs is performed in this paper. A set of equivalent lumped-
element circuit models for two annular TSV interconnects is proposed, with MOS …