The concept of chemical mechanical planarization (CMP) was invented in IBM in the early
1980s by Klaus D. Beyer in an attempt to create a highly planar surface and enable …

The semiconductor industry is the backbone of exponentially growing digitization. Countries
from the east and the west both are investing significantly to accelerate this growth …

Power dissipation and off-chip bandwidth restrictions are critical challenges that limit
microprocessor performance. Ternary content addressable memories (TCAM) hold the …

Design for Manufacturability and Yield for Nano-Scale CMOS walks the reader through all
the aspects of manufacturability and yield in a nano-CMOS process and how to address …

Solid-state microcellular foaming (SSMF) process was used to produce porous chemical
mechanical polishing (CMP) pads in a variety of pore size and porosity range, using a …

The present work develops a flexible and robust solution strategy to resolve coupled
systems comprised of large numbers of flowing particles embedded within a fluid. A model …

Double sided polishers are commonly used for industrial applications, such as lapping of
silicon substrates and chemical mechanical planarization (CMP) of rigid disks. Whereas a …

For the last 60 years, the development of cutting-edge semiconductor devices has strongly
emphasized scaling; the effort to scale down current CMOS devices may well achieve the …

Advanced ceramics with high surface quality and integrity are of increased interest in mold
and die making and optics. The demanded qualities are widely ensured by polishing …

Aligned growth of planar semiconductor nanowires (NWs) on crystalline substrates has
been widely demonstrated during the past two decades and was used for the fabrication of a …