Atomic layer etching at the tipping point: an overview

GS Oehrlein, D Metzler, C Li - … Journal of Solid State Science and …, 2015 - iopscience.iop.org
The ability to achieve near-atomic precision in etching different materials when transferring
lithographically defined templates is a requirement of increasing importance for nanoscale …

Plasma-controlled surface wettability: Recent advances and future applications

C Ma, A Nikiforov, D Hegemann… - International …, 2023 - Taylor & Francis
Materials with the desirable surface wettability are of key importance in diverse applications.
However, most of the existing chemical processes used for surface wettability control are …

Pulsed plasma etching for semiconductor manufacturing

DJ Economou - Journal of Physics D: Applied Physics, 2014 - iopscience.iop.org
Power-modulated (pulsed) plasmas have demonstrated several advantages compared to
continuous wave (CW) plasmas. Specifically, pulsed plasmas can result in a higher etching …

[HTML][HTML] Surface antibacterial properties enhanced through engineered textures and surface roughness: A review

I Georgakopoulos-Soares, EL Papazoglou… - Colloids and Surfaces B …, 2023 - Elsevier
The spread of bacteria through contaminated surfaces is a major issue in healthcare, food
industry, and other economic sectors. The widespread use of antibiotics is not a sustainable …

[图书][B] Semiconductor manufacturing handbook

H Geng - 2005 - dl.acm.org
This handbook will provide engineers with the principles, applications, and solutions
needed to design and manage semiconductor manufacturing operations. Consolidating the …

The challenges of advanced CMOS process from 2D to 3D

HH Radamson, Y Zhang, X He, H Cui, J Li, J Xiang… - Applied Sciences, 2017 - mdpi.com
The architecture, size and density of metal oxide field effect transistors (MOSFETs) as unit
bricks in integrated circuits (ICs) have constantly changed during the past five decades. The …

Dry efficient cleaning of poly-methyl-methacrylate residues from graphene with high-density H2 and H2-N2 plasmas

G Cunge, D Ferrah, C Petit-Etienne… - Journal of Applied …, 2015 - pubs.aip.org
Graphene is the first engineering electronic material, which is purely two-dimensional: it
consists of two exposed sp 2-hybridized carbon surfaces and has no bulk. Therefore …

[HTML][HTML] Thermal atomic layer etching: Mechanism, materials and prospects

C Fang, Y Cao, D Wu, A Li - Progress in Natural Science: Materials …, 2018 - Elsevier
In the semiconductors and related industries, the fabrication of nanostructures and
nanopatterns has become progressive demand for achieving near-atomic accuracy and …

[HTML][HTML] Plasma processing for advanced microelectronics beyond CMOS

N Marchack, L Buzi, DB Farmer, H Miyazoe… - Journal of Applied …, 2021 - pubs.aip.org
The scientific study of plasma discharges and their material interactions has been crucial to
the development of semiconductor process engineering and, by extension, the entire …

[HTML][HTML] Fluorine-based plasmas: main features and application in micro-and nanotechnology and in surface treatment

C Cardinaud - Comptes Rendus Chimie, 2018 - Elsevier
Fluorine cold plasmas produced by an electrical discharge in SF 6, CF 4, CHF 3 or C 4 F 8
gases, principally, have two main fields of application. The first and historical application is …