The coating of complex three-dimensional structures with ultrathin metal films is of great
interest for current technical applications, particularly in microelectronics, as well as for basic …

Recent trends in the microelectronics industry are requiring the growth of metallic first row
transition metal films by the atomic layer deposition (ALD) method. The ALD growth of noble …

A review on applications of metal-based inkjet inks for printed electronics with a particular
focus on inks containing metal nanoparticles, complexes and metallo-organic compounds …

This review provides a comprehensive overview of the most recent progress in chemistry
and applications of metal complexes containing heteroallylic ligands such as amidinates …

The thermolysis of metal compounds incorporating amidinate-type ligands (RN (H) C (X)
NR, where R is any alkyl and X is an alkyl or an amido) show a great complexity and …

Published papers on atomic-scale simulation of the atomic layer deposition (ALD) process
are reviewed. The main topic is reaction mechanism, considering the elementary steps of …

Chemical vapour deposition (CVD) and atomic layer deposition (ALD) are attractive
techniques for depositing a wide spectrum of thin solid film materials, for a broad spectrum of …

Atomic layer deposition (ALD) is a thin film deposition technique which operates via
repeated alternating and self-terminating surface-based reactions between a precursor and …

Recent progress in the simulation of the chemistry of atomic layer deposition (ALD) is
presented for technologically important materials such as alumina, silica, and copper metal …

Conspectus The deposition of thin solid films is central to many industrial applications, and
chemical vapor deposition (CVD) methods are particularly useful for this task. For one, the …