The harmful effects of lead on the environment and human health, coupled with the threat of
legislation, have prompted a serious search for lead-free solders for electronic packaging …

The chemical reaction at the interface between Cu and polyimide (PI) and between Cu and
TiN at room temperature has been investigated using X-ray photoelectron spectroscopy …

The polymer dielectrics used to fabricate multichip modules are discussed. Numerous
relevant properties of the dielectrics are compared and contrasted. It is shown that the …

When the first commercial polyimide was brought to market as Kapton* film in the early
1960s [l] the electronics industry was comparatively still in its infancy. At that time most …

The adhesion of plated metals on top of chemically treated epoxy layers for build-up
purposes was examined. Specifically, the influence of wet chemical pretreatments on the …

Recent interest in copper-based metallization for ultra fast logic devices has stimulated
extensive studies on thermal stability issues, as well as the search for novel deposition and …

The adhesion of electrochemically deposited copper on top of chemically surface modified
epoxy layers for buildup purposes is examined. Using a wet-chemical surface synthesis …

Molecular orbital theory is presented as a means to understanding metal-polymer interfacial
chemistry. While the systems used in molecular orbital studies tend to be rather idealized …

Because of their attractive thermal, mechanical, and electrical properties, polyimides are
used in a number of applications in high-performance military aircraft and spacecraft [l-41 …

Nitridation of Cu-Cr alloy films under an NH3 ambient was studied using in situ transmission
electron Microscopy. Cu-Cr thin films (40–100 nm) were deposited on a single crystal NaCl …