Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array
(BGA) rework components with lead-free solder Sn3. 0Ag0. 5Cu (SAC305) solder joints …

Inline soldering may hide many variables that can affect the soldering process especially
when the pcbs are transferred on the systems' conveyor inside a custom made …

Soft soldering is the primary joining technology used in electronics assembly and is
expected to remain so for the foreseeable future. Component removal for rework and repair …

Surface mounted components have become the choice of the electronics manufacturing
industry to allow the production of complex circuit boards. New components using increased …

Nonostante i prodotti elettronici diventino obsoleti ad un ritmo molto elevato, a causa dei
rapidi cambiamenti nella domanda dei consumatori e dei progressi tecnologici, la gestione …

Defects are still common in printed circuit board assembly (PCBA) technology despite all the
improvements made, and rework of PCBA is inevitable and performed manually in PCBA …

Component removal for rework and repair is traditionally achieved by re‐melting of the
solder, but the exposure of the assembly or its component parts to repeated …

Defective printed circuit board assembly (PCBA) is inevitable despite the improved statistical
process control methods in PCB manufacturing. Currently, manual rework equipment is …

This paper focuses on designing electric vehicle (EV) battery systems for a circular
economy, prioritizing reusing and recycling battery subcomponents. Design for disassembly …

Purpose–The generic design environment for a flexible printed‐circuit board assemblies
(PCBA) remanufacturing cell contains four interrelated complex design domains …