Embedded electronics package with multi-thickness interconnect structure and method of making same
RA Fillion - US Patent 10,497,648, 2019 - Google Patents
An embedded electronics package and method of manufac ture includes a support
substrate, a power semiconductor component coupled to a first side of the support substrate …
substrate, a power semiconductor component coupled to a first side of the support substrate …
Reconstituted substrate for radio frequency applications
GH See, R Chidambaram - US Patent 11,417,605, 2022 - Google Patents
The present disclosure relates to methods and apparatus for forming thin-form-factor
reconstituted substrates and semi conductor device packages for radio frequency …
reconstituted substrates and semi conductor device packages for radio frequency …
Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof
CJ Kapusta, RA Fillion, RIS Tuominen… - US Patent …, 2020 - Google Patents
An electronics package includes a support substrate, an electrical component having a first
surface coupled to a first surface of the support substrate, and an insulating structure …
surface coupled to a first surface of the support substrate, and an insulating structure …
Stacked electronics package and method of manufacturing thereof
RI Tuominen, AV Gowda - US Patent 10,312,194, 2019 - Google Patents
An electronics package includes an insulating substrate, a first electrical component coupled
to a top surface of the insulating substrate, and a second electrical component coupled to a …
to a top surface of the insulating substrate, and a second electrical component coupled to a …
Stacked electronics package and method of manufacturing thereof
RI Tuominen, AV Gowda - US Patent 10,700,035, 2020 - Google Patents
An electronics package includes an insulating substrate, a first electrical component coupled
to a bottom surface of the insulating substrate, and a first conductor layer formed adjacent …
to a bottom surface of the insulating substrate, and a first conductor layer formed adjacent …
Package structure and fabrication methods
HW Chen, S Verhaverbeke, G Park, G Cellere… - US Patent …, 2021 - Google Patents
US10886232B2 - Package structure and fabrication methods - Google Patents
US10886232B2 - Package structure and fabrication methods - Google Patents Package …
US10886232B2 - Package structure and fabrication methods - Google Patents Package …
Package core assembly and fabrication methods
HW Chen, S Verhaverbeke, G Park, K Cho… - US Patent …, 2024 - Google Patents
The present disclosure relates to semiconductor core assemblies and methods of forming
the same. The semiconductor core assemblies described herein may be utilized to form …
the same. The semiconductor core assemblies described herein may be utilized to form …
Package structure and fabrication methods
HW Chen, S Verhaverbeke, G Park, G Cellere… - US Patent …, 2022 - Google Patents
LLP (57) ABSTRACT The present disclosure relates to methods and apparatus for forming a
thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is …
thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is …
Electronics package with integrated interconnect structure and method of manufacturing thereof
CJ Kapusta, RA Fillion, RIS Tuominen… - US Patent …, 2020 - Google Patents
An electronics package includes an insulating substrate, an electrical component having a
back surface coupled to a first surface of the insulating substrate, and an insulating structure …
back surface coupled to a first surface of the insulating substrate, and an insulating structure …
Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
RI Tuominen, AV Gowda - US Patent 9,966,361, 2018 - Google Patents
An electronics package includes an insulating substrate and electrical components coupled
to a first surface of the insulating substrate. A multi-thickness conductor layer is formed on a …
to a first surface of the insulating substrate. A multi-thickness conductor layer is formed on a …