Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …

Miniaturization as well as manufacturing processes that electronics devices are subjected to
often results in to increase in operational parameters such as current density, temperature …

This study explores an efficient and reliable machine learning framework for determining the
low cycle fatigue life of lead-free solders, which does not necessarily separately test different …

Low-cycle thermal-mechanical fatigue loadings induce progressive and permanent
degradation of mechanical properties of lead-free solder materials, and thus reduce the …

The reliability concern in flip-chip-on-board (FCOB) technology is the high thermal mismatch
deformation between the silicon die and the printed circuit board that results in large solder …

The thermo-mechanical fatigue (TMF) behaviors and corresponding damage mechanisms of
Al-Si piston alloy were investigated in the temperature ranges of 120–350° C and 120–425° …

Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic
Sn–37wt% Pb, Sn–3.5 wt% Ag and Sn–4.0 wt% Ag–0.5 wt% Cu were carried out at room …

Low cycle fatigue (LCF) tests for 95.5 Sn–3.8 Ag–0.7 Cu and 99.3 Sn–0.7 Cu Pb-free
solders were conducted for two conditions of 25° C at 1 Hz and 125° C at 0.001 Hz. The …

The creep and fatigue properties of 95.5 Sn-3.8 Ag-0.7 Cu lead free solders were
investigated. Steady-state creep behavior for 95.5 Sn-3.8 Ag-0.7 Cu bulk solder specimens …

The effect of Sb contents (0–10wt%) on the reliability of Sn–Ag–Sb solder has been
investigated with isothermal low cycle mechanical fatigue tests. The solders tested were Sn …