(57) ABSTRACT A semiconductor product comprises a semiconductor Sub strate having a
top surface and a bottom surface including a semiconductor chip. The semiconductor …

US8859390B2 - Structure and method for making crack stop for 3D integrated circuits -
Google Patents US8859390B2 - Structure and method for making crack stop for 3D integrated …

US7812424B2 - Moisture barrier capacitors in semiconductor components - Google Patents
US7812424B2 - Moisture barrier capacitors in semiconductor components - Google Patents …

Disclosed are a method for metallization during semiconduc tor wafer processing and the
resulting structures. In this method, a passivation layer is patterned with first openings …

A crack detection line device and a method are disclosed. An embodiment comprises a
semiconductor device comprising a crack detection line within a chip, the crack detection …

A structure and method of making an offset-trench crackstop, which forms an air gap in a
passivation layer that is adjacent to a passivated top metal layer of a metal crackstop in an …

BACKGROUND Advanced semiconductor circuitry may use various pro grammable
interconnect elements to connect logic blocks for a number of applications, such as …

According to embodiments, a semiconductor device is provided. The semiconductor device
includes an insulation layer, an electrode, and a groove. The insulation layer is provided on …

US7250311B2 - Wirebond crack sensor for low-k die - Google Patents US7250311B2 -
Wirebond crack sensor for low-k die - Google Patents Wirebond crack sensor for low-k die …

(57) ABSTRACT A semiconductor chip having a current source coupled between a first
potential and an electrical node, a detection circuit having an input coupled to the electrical …