Interfacial reactions between lead-free solders and common base materials
T Laurila, V Vuorinen, JK Kivilahti - Materials Science and Engineering: R …, 2005 - Elsevier
The objective of this review is to study interfacial reactions between pure Sn or Sn-rich
solders, and common base metals used in Pb-free electronics production. In particular, the …
solders, and common base metals used in Pb-free electronics production. In particular, the …
[图书][B] Electrical contacts: fundamentals, applications and technology
M Braunovic, NK Myshkin, VV Konchits - 2017 - taylorfrancis.com
Various factors affect the performance of electrical contacts, including tribological,
mechanical, electrical, and materials aspects. Although these behaviors have been studied …
mechanical, electrical, and materials aspects. Although these behaviors have been studied …
Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution
Q Li, W Zhao, W Zhang, W Chen, Z Liu - International Journal of Fatigue, 2023 - Elsevier
Abstract SAC305 (Sn-3.0% Ag-0.5% Cu) BGA (ball grid array) solder joints were subjected
to thermal cycling. As the number of thermal cycles increased, the thickness of IMCs …
to thermal cycling. As the number of thermal cycles increased, the thickness of IMCs …
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
The effects of Cu and Ni additions on the wettability and interfacial reaction of Sn–Ag solder
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
with Cu substrate were investigated. The wettability of the Sn–3.0 Ag–0.5 Cu (or Ni) solder …
IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
The interfacial reaction, morphology of intermetallic compound (IMC) and shear strength
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
Interfacial reaction and mechanical properties of eutectic Sn–0.7 Cu/Ni BGA solder joints during isothermal long-term aging
The interfacial reactions and growth kinetics of intermetallic compound (IMC) layers formed
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements
X Bi, X Hu, X Jiang, Q Li - Vacuum, 2019 - Elsevier
Abstract The (Ni, Cu) 3 Sn 4 phase as intermetallic compounds (IMCs) plays an important
role in evaluating reliability of solder joints. The first-principles calculations were performed …
role in evaluating reliability of solder joints. The first-principles calculations were performed …
Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
JW Yoon, SW Kim, JM Koo, DG Kim… - Journal of Electronic …, 2004 - Springer
The interfacial reactions between two Sn-Cu (Sn-0.7 Cu and Sn-3Cu, wt.%) ball-grid-array
(BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at …
(BGA) solders and the Au/Ni/Cu substrate by solid-state isothermal aging were examined at …
Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
The interfacial reaction and morphology change of intermetallic compound (IMC) between
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization
The morphological and compositional evolutions of intermetallic compounds (IMCs) formed
at three Pb-free solder/electroless Ni-P interface were investigated with respect to the solder …
at three Pb-free solder/electroless Ni-P interface were investigated with respect to the solder …