In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC …

First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …

In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV) interposers will be investigated. Emphasis is …

Organic interposer (CoWoS-R) technology is one of the most promising heterogeneous
integration platforms for high performance computing (HPC) applications. Components such …

As the cost of advanced silicon nodes continue to rise, high-performance devices are
shifting towards advanced packaging to reduce the overall cost, increase functionality, and …

In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is
investigated. Emphasis is placed on the design, materials, process, fabrication, and …

Tensile tests on two kinds of electroplated copper foils with twins before and after annealing
were performed. One electroplating parameter results in a microstructure of< 110>-oriented …

As silicon scaling closer to physical limit, future reduction of the gate oxide does not lower
down the cost per transistor. But the demand of higher functionality and lower cost of …

Organic interposer (CoWoS®-R) is one of the most promising heterogeneous integration
platform solutions for high-speed and artificial intelligence applications. Components such …