The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

The pursuit of greater performance in microelectronic devices has led to a shrinkage of
bump size and a significant increase in electrical current. This has resulted in a high current …

In the present era of big data and internet of things, the use of microelectronic products in all
aspects of our life is manifested by the ubiquitous presence of mobile devices as i-phones …

Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging
industry due to environmental concerns. Both electromigration (EM) and thermomigration …

Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized
metallurgical joint, due to high power capability which causes solder joints to heat up to 200° …

Electromigration (EM) causes intermetallic and void growth that decreases the reliability and
lifetime of solder joints. As a diffusion-controlled process, EM is highly dependent on the …

The chemical industry is a major consumer of fossil fuels. Several chemical reactions of
practical value proceed with the gain or loss of electrons, opening a path to integrate …

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …

In the microelectronics industry the flip-chip (FC) technology is broadly used to enhance the
packaging density. However, the small size and the unique geometry of the FC solder joints …

Microbumps in three-dimensional integrated circuit now becomes essential technology to
reach higher packaging density. However, the small volume of microbumps dramatically …