Advanced packaging technology, also known as system scaling, bridges the gap between
chip and package sizes by mounting multiple chips on a single package substrate. 2.5-D …

Thermal management and reliability are two critical aspects of designing an advanced flip
chip package. Lidded and lidless are one of the most important variations depending on …

Heterogeneous integration technology makes possible the integration of multiple separately
manufactured components into a single higher level assembly with enhanced functionality …

The 2.5 D packaging technology is a high–performance method for electronic packaging.
This study addresses the reliability issues of 2.5 D packaging during the manufacturing …

The projected speckle-based three-dimensional digital image correlation method (3D-DIC)
is being increasingly used in the reliability measurement of microelectronic packaging …

According to the theory of elastic–plastic mechanics, the stress and deformation of a die
attach structure under a temperature load were studied. An analytical relation between the …

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous
integration packages, are widely used in high I/O (Input/Output) density and high …

Purpose This paper aims to use rigorous finite element simulations to investigate the impact
of different substrate systems on the warpage behavior of silicon (Si) chips of power …

With the wide application of motors in deep sea exploration, deep-sea motors require a
higher power density and a longer lifetime. Motor lifetime mainly depends on the thermo …

Fan-out (FO) packages are in high demand for smartphones and Internet of Things (IoT)
devices because they allow for the integration of multiple components within a single …